Near-Melting-Point Annealed CuI Film

Dense, Continuous, UV-Responsive

This CuI film achieves dense and continuous morphology via near-melting-point annealing, overcoming porosity and discontinuity, and is ready for high-performance UV photodetectors.

Peijie, Qian · Lv, Yanfei · Xi, Junhua · Yujia, Lin · Li, Fu · Zhao, Shichao

Materials Letters 2026

Specifications

On-off ratio
{'zh': '11', 'en': '11'}
Rise time
{'zh': '156', 'en': '156'} ms
Fall time
{'zh': '21', 'en': '21'} ms
Responsivity
{'zh': '185', 'en': '185'} mA/W
Detectivity
{'zh': '1.12e11', 'en': '1.12e11'} Jones

Advantages

Dense and continuous film

Near-melting-point annealing eliminates pores and yields dense, continuous CuI films, facilitating carrier transport and device performance.

Fast response

The device exhibits rise/fall time of only 156/21 ms, suitable for fast detection.

Simple fabrication

Fabrication only requires copper iodination and annealing, without complex equipment.

Applications