Sn-Ag-Cu-Al Active Solder

Low-temperature soldering for high-volume SiCp/Al

Ultrasonic-assisted soldering in air at 250 ℃ achieves simultaneous wetting and bonding of both Al matrix and SiC particles, yielding high joint strength without high pressure.

Xu, Guojing · Ma, Xinran · Wenkang, Du · Zhao, Pu · Xia, Yuanhang · Li, Zhengwei · Xu, Zhiwu · Yan, Jiuchun

Composites Part A: Applied Science and Manufacturing 2025

Specifications

joint shear strength

{'zh': '52.1', 'en': '52.1'} MPa

Advantages

Soldering performed in air

Ultrasonic action time only 20 s