Lighter than pure Cu foil
Breaking the thickness limit of physical methods via electroless plating and electroplating with Sn/Ni transition layers, achieving lightweight and conductive composite foil.
Xuan-Le, Chen · Xuekun, Zeng · Shiyu, Li · Ye, Nan · Yu, Zhan · Ziyi, Gong · Tang, Jiancheng · Zhuo, Haiou
Applied Surface Science 2024