Helium Ion-Assisted Wet Etching

Etched surface roughness ≈0.9 nm, resist-free, works on irregular surfaces

Using a focused helium ion beam to disrupt the crystal lattice, this method achieves high-resolution, resist-free wet etching of SiC, enabling nanofabrication on irregular surfaces and suspended structures without spin-coating and development.

Wen, Xiaolei · Zhang, Lansheng · Wang, Xiuxia · Chen, Lin · Sun, Jian · Hu, Huan

Small Methods 2024

Specifications

Etched surface roughness
{'zh': '', 'en': '0.9'} nm

Advantages

Sub-nanometer focused helium ion beam spot

No need for resist spin-coating and development

One-step fabrication of suspended nanobeam structures