HPHT-Treated CuCr50 Composite

Strength & Ductility Up

Through HPHT treatment at 5 GPa and 900 °C, the CuCr50 composite achieves simultaneously enhanced tensile strength and elongation, overcoming the conventional strength-ductility trade-off.

Long, Weiyang · Zheng, Wei · Zhang, Zaoli · Zhu, Zhiyuan · Zhang, Guoshang · Yan, Yifan · Wu, Haoran · You, Mingzhu · Kai, Li · Pengfei, Yue · Zhang, Hongfei · Rui, li · Zhao, Yonghao · Song, Kexing

Journal of Materials Science and Technology 2026

Specifications

Tensile strength

{'zh': '408.39', 'en': '408.39'} MPa

Elongation

{'zh': '44.85', 'en': '44.85'} %

Advantages

Simultaneous enhancement

The treatment promotes the formation and continuous refinement of dislocation cells, enabling coordinated deformation of Cu and Cr, thereby enhancing both strength and toughness.

Enhanced interfacial bonding

Improves roundness of Cr particles and enhances bonding strength of the Cu/Cr interface, allowing effective stress transfer and mitigating stress concentration.

Dislocation engineering

Dislocation cells develop in Cu, and stress transfer facilitates their formation and refinement in Cr, enhancing deformation potential.

Applications

• Cu-Cr contact materials：Used to fabricate high-strength, high-ductility electrical contact materials, replacing conventional CuCr alloys.
• high-strength high-conductivity copper alloys：Serves as a copper-based alloy with both high strength and high ductility, meeting dual demands of conductivity and mechanical performance.
• electrical contacts for power equipment：Used in electrical contacts for power equipment, withstanding mechanical loads while maintaining reliable conduction.
• metal matrix composites：As a metal matrix composite, optimized by HPHT treatment to improve interfacial bonding and dislocation structure for enhanced overall performance.