Nearly crack-free surface
By controlling abrasive exposure height via gel, nanoscale cutting depth is achieved, leaving SiC substrate surfaces nearly crack-free.
Luo, Qiufa · Lu, Jing · Huang, Hui
Materials 2024
Heating temperature 110 °C, resin to gel ratio 4:6
Surface with almost no cracks
Nanoscale cutting depth achieved by controlling abrasive exposure height