Bimodal Diamond/SiC Composite

High Conductivity, Low Expansion

By tailoring phase composition via bimodal diamond particles and high-density carbon source, it reduces residual silicon and achieves synergistic enhancement of thermal conductivity, thermal expansion coefficient, and elastic modulus.

Mingkang, Zhang · Zhouxi, Tan · Huang, Yihua · Huang, Zhengren · Liu, Xuejian · Zhang, Ke

Ceramics International 2024

Specifications

Thermal conductivity

{'zh': '666', 'en': '666'} W/m·K

of thermal expansion

{'zh': '2.73 × 10⁻⁶', 'en': '2.73 × 10⁻⁶'} K⁻¹

Elastic modulus

{'zh': '753', 'en': '753'} GPa