Near-Zero Residual Stress
Surface-activated bonding enables tunable interfacial structure and low thermal boundary resistance, with residual stress an order of magnitude lower than hydrophilic bonding, facilitating reliable heat dissipation under high thermal loads.
He, Yang · Wan, Shun · Zhou, Shi · Zeming, Huang · Chang, Yongwei · Yang, Yu · Gao, Xiaowu · Xu, Yongze · Yang, J. · Shang, Gao · Ma, Dengke · Zhou, Yan · Sun, Huarui
Applied Physics Letters 2025
Residual stress an order of magnitude lower than hydrophilic bonding
Thermal boundary resistance significantly decreased at high working temperatures
Amorphous interlayer thickness and thermal boundary resistance tunable by annealing