Root-Anchored Y₂O₃ Coating

Hardness rises under thermal shock

A thermally induced Cu₂O root-like interlocking network transforms cracks into reinforcement, boosting hardness and interfacial adhesion while preserving etch resistance.

Xiao, Shu · Liu, Jiancheng · Luzhan, Zhang · Zishuo, Ye · Ching Yi, Wu · Hui, Chen · Chu, Paul K.

ACS Applied Materials & Interfaces 2026

Specifications

Hardness after thermal shock

{'zh': '21.82', 'en': '21.82'} GPa

Initial hardness

{'zh': '16.31', 'en': '16.31'} GPa

Advantages

Cracks turn into reinforcement

The thermally induced Cu₂O phase preferentially wets the vertical grain boundaries of the columnar Y₂O₃ coating, forming a dense root-like 3D interlocking network that transforms microcracks from structural defects into diffusion-assisted reinforcing features, stabilizing both coating integrity and interfacial adhesion.

Hardness rises 34%

After 50 thermal shock cycles, the coating hardness increases from 16.31 to 21.82 GPa, about 34% higher, without sacrificing plasma etching resistance.

Etching resistance retained

Despite 50 thermal shock cycles and Cu₂O formation, the coating retains its original plasma etching resistance, ensuring continued protection in service environments.

Applications

• Plasma etching equipment：Provides thermal-shock-resistant copper parts, directly replacing conventional coated parts prone to delamination
• High-power semiconductor：Ensures long-term stable operation of copper components in high-power semiconductor manufacturing
• High-power semiconductor：Extends the service life of copper components in high-power semiconductor equipment
• Metal-ceramic coatings：Uses thermally induced interfacial reaction to solve thermal mismatch delamination in metal-ceramic coatings
• High-temperature component protection：Provides a coating solution for high-temperature components with both mechanical reinforcement and etching resistance