Bis(4-methoxyphenyl)thiourea Additive

Fewer buried-interface defects

A thiourea additive tailored to blade-coating crystallization dynamics, specifically accumulating at the buried interface to reduce deep-level defects and voids, enabling both high efficiency and long-term stability.

Mengen, Ma · Yujiao, Ma · Wang, Yao · Wu, Shaohang · Liu, Chong · Mai, Yaohua

Nano-Micro Letters 2024

Specifications

认证效率
{'zh': '23.75', 'en': ''} %
孔径面积
{'zh': '60.84', 'en': ''} cm²

Advantages

Module MPPT T90 > 1000 h in ambient air