Covalently Interconnected BN/CNTs Hybrid Phase Change Composites

5.92 W·m⁻¹·K⁻¹ thermal conductivity

Covalently bonded BN/CNTs hybrid networks form continuous thermally conductive pathways within the phase change matrix, maintaining electrical insulation while combining high thermal conductivity with latent heat storage.

Donghao, Fan · Minyan, Zhao · Yin, Shuai · Peng, Xiaotian · Guangtai, Zhang · Peng, Hao

Advanced Functional Materials 2026

Specifications

Thermal conductivity

{'zh': '5.92', 'en': '5.92'} W·m⁻¹·K⁻¹

Latent heat

{'zh': '92.5', 'en': '92.5'} J·g⁻¹

Mass loss

{'zh': '2', 'en': '2'} %

Operating temperature reduction

{'zh': '10–30', 'en': '10–30'} °C

Solar-thermal conversion efficiency

{'zh': '80', 'en': '80'} %

Electro-thermal conversion efficiency

{'zh': '80', 'en': '80'} %

Advantages

Continuous stable heat conduction paths

BN and CNTs are covalently linked via amide bonds, forming a chemically interconnected network with homogeneous dispersion, thereby greatly enhancing thermal conduction.

Maintains electrical insulation

Despite high thermal conductivity, the composite remains electrically insulating, suitable for electronics requiring electrical safety.

Excellent cycling stability

After 100 thermal cycles, mass loss is below 2%, demonstrating excellent leakage resistance and long-term reliability.

Dual-mode energy conversion

In active modes, PPBC films deliver solar-thermal and electro-thermal conversion efficiencies exceeding 80%, remaining stable over 50 cycles, suitable for self-heating or energy harvesting.

Applications

• Battery thermal management：Acts as a phase-change heat storage coating to lower battery temperature and prevent thermal runaway.
• LED chip heat dissipation：Directly coated on LED chips to dissipate heat uniformly and avoid local overheating.
• Flexible electronics thermal management：Flexible matrix conforms to bending, providing heat dissipation and electrical insulation for wearables.
• High-power device packaging：Serves as high-thermal-conductivity packaging to efficiently extract heat from power devices while maintaining insulation.