MXene@AgNPs thermal silver adhesive

Ultra-high TC

MXene@AgNPs secondary fillers enable AgNP bridging to reduce filler-filler interfacial thermal resistance, achieving ultra-high thermal conductivity via low-temperature sintering.

Li, Liu · Tao, Chen · Liping, Han · Zhuo, Qian · Li, Junpeng · Gan, Guoyou

Applied Surface Science 2024

Specifications

wt wt AgMFs

{'zh': '63', 'en': '3'} wt% MXene

热导率

{'zh': '65.51', 'en': ''} Wm⁻¹K⁻¹