Conductive Fixed Abrasive Polishing Disc

14.12 μm/h MRR

Designed for ECMP of SiC substrates, significantly improving removal rate and reducing surface roughness.

Luo, Qiufa · Yikun, Hu · Yiyang, Zhu · Lu, Jing · Ke, Congming · Huang, Hui

Materials Science in Semiconductor Processing 2026

Specifications

材料去除率

{'zh': '14.12', 'en': ''} μm/h

表面粗糙度

{'zh': '6.22', 'en': ''} nm

优化后表面粗糙度

{'zh': '5.02', 'en': ''} nm