Multi-beam glass slicing

200 μm low damage

Spatiotemporal multi-beam control induces a hybrid layer of only 9.65–19.81 μm inside glass-ceramic, enabling ultra-thin, low-damage slicing.

Bin, Liu · Luo, Zhang · He, Zongtai · Zehao, Cao · Zhaoqing, Li · Li, Qianliang · Zeng, Xiaomei · Cheng, Jian · Da, Liu · Zhai, Zhongsheng · Liu, Dun

Journal of Manufacturing Processes 2026

Specifications

Hybrid layer thickness

{'zh': '9.65–19.81', 'en': '9.65–19.81'} μm

Slice thickness

{'zh': '200', 'en': '200'} μm

Post-cut surface roughness (interface 1)

{'zh': '6.688', 'en': '6.688'} μm

Post-cut surface roughness (interface 2)

{'zh': '7.677', 'en': '7.677'} μm

Polished surface roughness (interface 1)

{'zh': '0.243', 'en': '0.243'} μm

Polished surface roughness (interface 2)

{'zh': '0.357', 'en': '0.357'} μm

Advantages

Hybrid layer thinned to 9.65 μm

By regulating energy and stress distribution with multiple beams, crack formation is directionally controlled, producing a hybrid layer of only 9.65–19.81 μm, enabling ultra-thin slicing.

Low slicing damage

After slicing, surface roughness Sa of the two interfaces decreased from 12.76 μm and 19.33 μm to 6.688 μm and 7.677 μm; after polishing, to 0.243 μm and 0.357 μm, with no hidden cracks or damage.

Applications

• Ultrafast laser processing：Offers a new multi-beam controlled slicing approach, expanding ultrafast laser processing capabilities.
• Hard brittle material cutting：Solves ultra-thin cutting challenges for hard brittle materials like glass-ceramic with low damage.
• Precision optics fabrication：Produces optical substrates as thin as 200 μm with surface roughness down to 0.243 μm, meeting precision optics requirements.
• Semiconductor packaging substrate processing：Enables ultra-thin processing of glass-ceramic substrates in semiconductor packaging with reduced damage.