0.28-fold lower interface barrier
TiC-bonded carbon nanotubes significantly enhance electrical/thermal transport and reliability at the electrode/CNT interface for vertical interconnects in 3D optoelectronic devices.
Du, Huanhuan · Pei, Jiang · Xiao, Dongyang · Wang, Wei · Yongwei, Tang · Xi, Yang · Sun, Leimeng
Carbon 2025