Hierarchically Porous Carbon Foam

Dual EM absorption & thermal

A carbon foam with 3D internal-external interconnected hierarchically porous skeleton that achieves efficient EMW absorption and thermal management at low density without secondary phases, utilizing multi-level scattering and enhanced dielectric loss.

Wenqi, Cui · Jiajun, Wu · Liang, Jiuming · Zhang, Xialan · Lin, Qilang

Journal of Industrial and Engineering Chemistry 2026

Specifications

Optimum reflection loss

{'zh': '-47.16', 'en': '-47.16'} dB

Effective absorption bandwidth

{'zh': '3.61', 'en': '3.61'} GHz

Bulk density

{'zh': '0.1611', 'en': '0.1611'} g/cm^3

Mechanical strength

{'zh': '1.87', 'en': '1.87'} MPa

Thermal conductivity

{'zh': '0.6511', 'en': '0.6511'} W/(m·K)

Specific absorption performance

{'zh': '292.74', 'en': '292.74'} dB·cm^3/g

Advantages

Enhanced absorption

The 3D internal-external interconnected hierarchically porous skeleton facilitates multi-level multiple scattering of EMWs, with abundant pores and defects further enhancing dielectric loss, resulting in an optimum reflection loss of −47.16 dB.

Broad bandwidth

The effective absorption bandwidth reaches 3.61 GHz, covering a wide frequency range for broadband absorption applications.

Low density

The bulk density is only 0.1611 g/cm³, beneficial for lightweight applications, while maintaining a mechanical strength of 1.87 MPa.

Thermally conductive

With a thermal conductivity of 0.6511 W/(m·K), it offers thermal management capability for integrated heat dissipation and absorption.

Applications

• EM shielding & absorbing：Uses porous skeleton multi-scattering to absorb EM waves, replacing conventional coatings.
• Spacecraft thermal control：Low-density carbon foam with thermal conductivity for lightweight heat dissipation and absorption.
• Electronics thermal management：Thermal conductivity of 0.6511 W/(m·K) with absorption for chip/device thermal management.
• Flexible electronics substrate：Porous carbon foam is compressible, potential flexible substrate with absorption.
• 5G device EM compatibility：EAB of 3.61 GHz covers 5G bands, reducing inter-device interference.