Silver-coated polymer microspheres
Ultrahigh thermal conductivity in both directions
Hot-pressing core-shell Ag@PEI microspheres forms segregated networks that enhance both in-plane and through-plane thermal conductivity while also providing EMI shielding.
Yang, Lan · Zhao, Junyu · Wang, Chengyang · Ruotong, Pang · Wang, Daming · Zhao, Xiaogang · Chen, Chunhai
Chemical Engineering Journal 2024
Specifications
- In-plane thermal conductivity
- {'zh': '19.9', 'en': '19.9'} W/mK
- EMI shielding effectiveness
- {'zh': '40.1', 'en': '40.1'} dB
Advantages
Conducts both in-plane and through-plane
The silver shell forms a continuous 3D network that, after hot pressing, creates both horizontal and vertical heat conduction paths.
Segregated network boosts performance
Compared to random filler distribution, conductivity improves by 331% in-plane and 1264% through-plane, showing the advantage of segregated structure.
Doubles as EMI shield
The silver network also provides 40.1 dB of electromagnetic interference shielding.
Applications
- Thermal management of electronics：Enables thermal pads that dissipate heat in both directions, preventing hot spots in high-power electronics.
- Thermally conductive polymers：Acts as a high-fill masterbatch to create isotropic thermally conductive polymer composites.
- Flexible electronics：Forms a continuous network that maintains heat dissipation under bending in flexible devices.
- EMI shielding materials：Eliminates extra shielding layers by providing EMI shielding in the same material.