p-GaN High Electron Mobility Transistor

Enhanced resilience in high-intensity radiated fields

This p-GaN HEMT, with optimized gate length, slows temperature rise and delays breakdown under high-intensity radiated fields, offering better electromagnetic protection for aerospace electronic systems.

Ma, Zhenyang · Dexu, Liu · Duan, Zhaobin · Yicheng, Li · Jiahao, Liu · Meng, Xie

IEEE Sensors Journal 2024

Advantages

Longer p-GaN length results in longer breakdown time

Sparser electric field distribution

Time from sharp temperature accumulation to breakdown accounts for 1/4 of total lifetime